DocumentCode :
1166442
Title :
Drive-Current Enhancement in Ge n-Channel MOSFET Using Laser Annealing for Source/Drain Activation
Author :
Zhang, Qingchun ; Huang, Jidong ; Wu, Nan ; Chen, Guoxin ; Hong, Minghui ; Bera, L.K. ; Zhu, Chunxiang
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore
Volume :
27
Issue :
9
fYear :
2006
Firstpage :
728
Lastpage :
730
Abstract :
A gate-first self-aligned Ge nMOSFET with a metal gate and CVD HfO 2 has been successfully fabricated using KrF laser annealing (LA) as dopant-activation annealing. By applying an aluminum laser reflector on TaN metal gate, source/drain (S/D) regions are selectively annealed without heating the gate stack. Small S/D resistance and good gate-stack integrity are achieved simultaneously. As a result, a larger drive current and a lower threshold voltage are achieved in Ge nMOSFET using LA activation than that using conventional rapid thermal annealing activation
Keywords :
MOSFET; chemical vapour deposition; elemental semiconductors; hafnium compounds; high-k dielectric thin films; krypton compounds; laser beam annealing; tantalum compounds; HfO2; KrF; TaN; aluminum laser reflector; chemical vapor depostion; dopant-activation annealing; drive-current enhancement; gate-stack integrity; germanium n-channel MOSFET; high-k gate dielectric; laser annealing; metal gate; source/drain activation; Aluminum; Dielectric devices; Dielectric substrates; Germanium; Hafnium oxide; Heating; MOS devices; MOSFET circuits; Rapid thermal annealing; Silicon; Germanium; MOSFET; high-; laser annealing (LA);
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2006.880655
Filename :
1683860
Link To Document :
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