DocumentCode :
1167409
Title :
A Novel Interface for Eddy Current Displacement Sensors
Author :
Nabavi, Mohammad Reza ; Nihtianov, Stoyan
Author_Institution :
Electron. Instrum. Lab., Delft Univ. of Technol., Delft
Volume :
58
Issue :
5
fYear :
2009
fDate :
5/1/2009 12:00:00 AM
Firstpage :
1623
Lastpage :
1632
Abstract :
In this paper, we propose a novel interface concept for eddy current displacement sensors. A measurement method and a new front-end circuit are also proposed. The front-end circuit demonstrates excellent thermal stability, high resolution, and low-power consumption. The proposed idea is analytically investigated. The demodulation principle, as well as the interface implementation, is also addressed. This interface is being introduced for measuring submicrometer displacements in medium- to high-resolution applications. The interface system consumes less than 12 mW and has an extremely low thermal drift. The interface circuit will be implemented as a system-in-a-package (SIP). The full-scale range of displacement is 1 mm with 50-kHz signal bandwidth and 11-bit resolution (less than 500 nm). The signal conditioning circuit utilizes a standard 0.35- mum complementary metal-oxide semiconductor (CMOS) technology. Simulation results, which were achieved on the basis of experimental results of testing a prototype coil, also confirm the high performance of the interface system, as expected from analytical results. Compared with previous reports, this low-power interface system demonstrates a much lower temperature drift.
Keywords :
CMOS integrated circuits; demodulation; displacement measurement; eddy currents; electric sensing devices; low-power electronics; system-in-package; thermal stability; CMOS technology; SIP; bandwidth 50 kHz; complementary metal-oxide semiconductor technology; demodulation principle; eddy current displacement sensor; front-end circuit; interface implementation; low-power interface system; signal conditioning circuit; size 0.35 mum; submicrometer displacement measurement; system-in-a-package; thermal drift; thermal stability; Displacement sensors; eddy current; low-power front-end; sensor interfacing; thermal drift;
fLanguage :
English
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9456
Type :
jour
DOI :
10.1109/TIM.2009.2012945
Filename :
4785518
Link To Document :
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