DocumentCode
1167762
Title
Invitation from the ISSCC 2007 Technical Program Chair
Author
Van der Spiegel, Jan
Author_Institution
Technical Program Chair, ISSCC 2007 jan@seas.upenn.edu
Volume
12
Issue
1
fYear
2007
Firstpage
75
Lastpage
75
Abstract
The conference theme is ´The 4 Dimensions of IC Innovation,´ in recognition of the emerging synergisms between the various aspects of integrated circuit realization. A common theme among many of the papers is how to control power consumption in deep-submicron technologies while pushing for higher performance and functionality. This requires careful optimization among the four dimensions of IC design (technology, devices, circuits, and architecture).
fLanguage
English
Journal_Title
Solid-State Circuits Society Newsletter, IEEE
Publisher
ieee
ISSN
1098-4232
Type
jour
DOI
10.1109/N-SSC.2007.4785556
Filename
4785556
Link To Document