Title :
A new asymmetrical halo source GOLD drain (HS-GOLD) deep sub-half-micrometer n-MOSFET design for reliability and performance
Author :
Buti, Taqi N. ; Ogura, Seiki ; Rovedo, Nivo ; Tobimatsu, Kentaroh
Author_Institution :
IBM E. Fishkill Lab., Hopewell Junction, NY, USA
fDate :
8/1/1991 12:00:00 AM
Abstract :
An asymmetrical n-MOSFET device structure was developed that is suitable, in terms of reliability and performance, for scaling down to the sub-quarter-micrometer level without reduction of the supply voltage below 3.5 V. In this structure, large-tilt implantation is used to form the gate-overlapped LDD (GOLD) region at the drain electrode only. A halo (punchthrough stopper) is used at the source, but not at the drain. Superior hot carrier reliability and high punchthrough resistance are obtained using this device structure. A reliability-limited supply voltage of 4.2 V is obtained for an asymmetrical n-MOSFET with effective channel lengths as short as 0.25 μm. By extrapolation from the measured threshold roll-off characteristics, the authors expect that this structure can be designed with substantially shorter channel length while maintaining the 3.5-V supply voltage
Keywords :
insulated gate field effect transistors; reliability; semiconductor technology; 0.25 micron; 3.5 to 4.2 V; HS-GOLD; asymmetrical halo source GOLD drain; asymmetrical n-MOSFET device structure; channel lengths; deep sub-half-micrometer; gate-overlapped LDD; hot carrier reliability; large-tilt implantation; performance; punchthrough resistance; punchthrough stopper; reliability; reliability-limited supply voltage; scaling down; sub-quarter-micrometer level; submicron MOSFETs; supply voltage; threshold roll-off characteristics; Electrodes; Extrapolation; Gold; Hot carriers; Implants; Laboratories; MOSFET circuits; Power system reliability; Reliability engineering; Voltage;
Journal_Title :
Electron Devices, IEEE Transactions on