DocumentCode :
1169396
Title :
Analysis of Convective Thermal Resistance in Ducted Fan-Heat Sinks
Author :
Kim, Seo Young ; Webb, Ralph L.
Author_Institution :
Thermal/Flow Control Res. Center, Korea Inst. of Sci. & Technol., Seoul
Volume :
29
Issue :
3
fYear :
2006
Firstpage :
439
Lastpage :
448
Abstract :
The thermal performance of plate fin, round pin-fin, and offset strip-fin heat sinks with a duct-flow type fan arrangement was analytically evaluated. Heat sinks of 65mmtimes60 mm plan areatimes50 mm height with a 4300-RPM dc fan (60mmtimes15mm) were chosen for the performance comparison. A constant temperature, 6-mm thick heat sink base plate is assumed so that thermal spreading resistance is not involved. The operating point on the fan curve is based on the flow pressure drop impedance curve through a heat sink using the friction factor correlation for the chosen heat sink. The loss coefficients at both the entrance and the exit of the heat sink are included in the flow impedance curve. The operating point is defined by the balance point of the flow impedance curve and the fan performance curve. After determining the operating air velocity, the convective thermal resistance of heat sinks is evaluated from the Nusselt number correlation for the chosen heat sink. Results obtained show that optimized round pin-fin heat sinks provide 32.8%-46.4% higher convective thermal resistance compared to an optimized plate-fin heat sink. The optimized offset strip-fin heat sink shows a slightly lower convective thermal resistance than the plate-fin heat sink. As the offset strip length decreases, however, thermal performance seriously deteriorates
Keywords :
convection; fans; heat sinks; thermal management (packaging); thermal resistance; 15 mm; 50 mm; 6 mm; 60 mm; 65 mm; Nusselt number correlation; convective thermal resistance; duct-flow fan arrangement; ducted fan-heat sinks; fan performance; flow impedance; friction factor correlation; loss coefficients; offset strip-fin; plate fin; round pin-fin; thermal spreading resistance; Friction; Heat sinks; Heat transfer; Impedance; Resistance heating; Strips; Surface resistance; Temperature; Thermal conductivity; Thermal resistance; Convective thermal resistance; ducted-fan heat sink; fan curve; offset strip fin; pin fin; plate fin;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2006.880522
Filename :
1684164
Link To Document :
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