Title :
Prediction of Solder Bump Formation in Solder Jet Packaging Process
Author :
Wang, Wei ; Hong, Fangjun ; Qiu, Huihe
Author_Institution :
Dept. of Thermal Energy Eng., Beijing Polytech. Univ.
Abstract :
Precise solder bump shape prediction is crucial for the application of the solder jet bumping process to microelectronic component packaging. In the present study, numerical simulation of both the dynamics and phase change responses during a metal droplet impingement is conducted by introducing a nonconstant interfacial heat transfer coefficient, which varies with time and position. Comparison between the numerical and experimental results for a large metal droplet demonstrates the validity of the numerical method. The results of many simulation cases are presented corresponding to typical solder jet bumping conditions. Variations in the impact velocity, initial droplet size, and droplet temperature and substrate temperature are investigated to understand their impact on the formation of solder bumps
Keywords :
heat transfer; integrated circuit packaging; soldering; thermal management (packaging); droplet temperature; heat transfer coefficient; impact velocity; initial droplet size; metal droplet impingement; microelectronic component packaging; phase change response; solder bump formation; solder bump shape prediction; solder jet packaging; substrate temperature; Electronic packaging thermal management; Electronics packaging; Heat transfer; Microelectronics; Rough surfaces; Shape; Surface roughness; Temperature; Thermal conductivity; Viscosity; Microelectronic component packaging; solder bump;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2006.880519
