• DocumentCode
    1169649
  • Title

    Influence Coefficient Method for Calculating Discrete Heat Source Temperature on Finite Convectively Cooled Substrates

  • Author

    Muzychka, Yuri S.

  • Author_Institution
    Fac. of Eng. & Appl. Sci., Memorial Univ. of Newfoundland, St. John´´s, Nfld.
  • Volume
    29
  • Issue
    3
  • fYear
    2006
  • Firstpage
    636
  • Lastpage
    643
  • Abstract
    A simple method is developed for predicting discrete heat source temperatures on a finite convectively cooled substrate. The method is based on the principle of superposition using a single source solution for the mean or maximum contact temperature of an eccentric uniform heat source on a rectangular substrate. By means of influence coefficients, the effect of neighboring source strength and location may be assessed. It is shown that the influence coefficients represent localized thermal resistances, which must be weighted according to source strength. For a system of N heat sources, there exists N effects of source strength and position on any one heat source. This includes a self effect (source of interest) and N-1 influence effects (neighboring sources). The method is developed for isotropic, orthotropic, and compound systems. Convection in the source plane is addressed for isotropic and orthotropic systems. Expressions are developed for both mean and centroidal temperature
  • Keywords
    convection; thermal management (packaging); thermal resistance; discrete heat source temperature; eccentric uniform heat source; finite convectively cooled substrates; influence coefficient method; isotropic system; neighboring source strength; orthotropic system; rectangular substrate; single source solution; thermal resistances; Boundary conditions; Eigenvalues and eigenfunctions; Fourier series; Heat sinks; Packaging; Resistance heating; Substrates; Temperature; Thermal conductivity; Thermal resistance; Compound systems; conduction; electronics cooling; heat sinks; heat spreaders; orthotropic properties; spreading resistance;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2006.880477
  • Filename
    1684188