Title : 
Multiple integration method for a high signal-to-noise ratio readout integrated circuit
         
        
            Author : 
Kang, Sang Gu ; Woo, Doo Hyung ; Lee, Hee Chul
         
        
            Author_Institution : 
Dept. of Electr. Eng. & Comput. Sci., KAIST, Daejeon, South Korea
         
        
        
        
        
        
        
            Abstract : 
A multiple integration method is reported that greatly improves the signal-to-noise ratio (SNR) for applications with a high-resolution infrared (IR) focal plane array. The signal from each pixel is repeatedly sampled into an integration capacitor and then output and summed into an outside memory that continues for n read cycles during each period of a frame. This method increases the effective capacity of the charge integration and improves sensitivity. Because a low-noise function block and high-speed operation of the readout circuit is required, a new concept is proposed that enables the readout circuit to perform digitization by a voltage skimming method. The readout circuit was fabricated using a 0.6-μm CMOS process for a 64×64 midwavelength IR HgCdTe detector array. The readout circuit effectively increases the charge storage capacity to 2.4×108 electrons and then provides a greatly improved SNR by a factor of approximately 3.
         
        
            Keywords : 
CMOS integrated circuits; circuit noise; focal planes; infrared detectors; integrated circuit manufacture; readout electronics; sensitivity; 0.6 micron; CMOS process; HgCdTe detector array; charge storage capacity; high-resolution infrared focal plane array; integration capacitor; multiple integration method; readout integrated circuit; signal-to-noise ratio; voltage skimming method; Application specific integrated circuits; Capacitance; Capacitors; Circuit noise; Costs; Infrared detectors; Signal resolution; Signal to noise ratio; Timing; Voltage; Infrared focal plane arrays (IR FPAs); readout integrated circuit; signal-to-noise ratio (SNR);
         
        
        
            Journal_Title : 
Circuits and Systems II: Express Briefs, IEEE Transactions on
         
        
        
        
        
            DOI : 
10.1109/TCSII.2005.848984