DocumentCode
1170874
Title
Multilevel global placement with congestion control
Author
Chang, Chin-Chih ; Cong, Jason ; Pan, Zhigang ; Yuan, Xin
Author_Institution
Comput. Sci. Dept., Univ. of California, Los Angeles, CA, USA
Volume
22
Issue
4
fYear
2003
fDate
4/1/2003 12:00:00 AM
Firstpage
395
Lastpage
409
Abstract
In this paper, we develop a multilevel global placement algorithm (MGP) integrated with fast incremental global routing for directly updating and optimizing congestion cost during physical hierarchy generation. Fast global routing is achieved using a fast two-bend routing and incremental A-tree algorithm. The routing congestion is modeled by the wire usage estimated by the fast global router. A hierarchical area density control is developed for placing objects with significant size variations. Experimental results show that, compared to GORDIAN-L, the wire length-driven MGP is 4-6.7 times faster and generates slightly better wire length for test circuits larger than 100000 cells. Moreover, the congestion-driven MGP improves wiring overflow by 45%-74% with 5% larger bounding box wire length but 3%-7% shorter routing wire length measured by a graph-based A-tree global router.
Keywords
VLSI; circuit layout CAD; circuit optimisation; integrated circuit interconnections; integrated circuit layout; minimisation; network routing; network topology; VLSI layout; congestion control; congestion cost optimization; deep submicron ICs; fast incremental global routing; fast two-bend routing; hierarchical area density control; incremental A-tree algorithm; multilevel global placement algorithm; physical hierarchy generation; routing congestion modelling; wire usage estimation; Circuit testing; Hardware design languages; Integrated circuit interconnections; Optimization; Process planning; Routing; System performance; Uncertainty; Very large scale integration; Wire;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.2003.809661
Filename
1190977
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