DocumentCode
1170911
Title
Single-mode low-loss buried optical waveguide bends in GaInAsP/InP fabricated by dry etching
Author
Singh, J. ; Henning, H. ; Harlow, M. ; Cole, S.
Author_Institution
British Telecom Res. Labs., Ipswich, UK
Volume
25
Issue
14
fYear
1989
fDate
7/6/1989 12:00:00 AM
Firstpage
899
Lastpage
900
Abstract
Low-loss single-mode buried optical waveguide bends in MOVPE-grown InP-based materials are reported. Reactive ion etching (RIE) was used to fabricate the curves which were subsequently buried in InP to reduce optical losses and to control the number of lateral guided modes. Losses as low as 1.1 dB for 200 mu m radius of curvature and 0.3 dB for 300 mu m radius of curvature have been measured using TE-polarised light at 1.553 mu m wavelength.
Keywords
III-V semiconductors; gallium arsenide; indium compounds; integrated optics; optical interconnections; optical waveguide components; sputter etching; vapour phase epitaxial growth; 1.1 to 0.3 dB; 1.553 micron; 200 to 300 micron; GaInAsP-InP; MOVPE; RIE; TE-polarised light; dry etching; low-loss buried optical waveguide bends; optical losses; radius of curvature; reactive ion etching; single-mode buried optical waveguide bends; wavelength;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19890603
Filename
31926
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