• DocumentCode
    1170911
  • Title

    Single-mode low-loss buried optical waveguide bends in GaInAsP/InP fabricated by dry etching

  • Author

    Singh, J. ; Henning, H. ; Harlow, M. ; Cole, S.

  • Author_Institution
    British Telecom Res. Labs., Ipswich, UK
  • Volume
    25
  • Issue
    14
  • fYear
    1989
  • fDate
    7/6/1989 12:00:00 AM
  • Firstpage
    899
  • Lastpage
    900
  • Abstract
    Low-loss single-mode buried optical waveguide bends in MOVPE-grown InP-based materials are reported. Reactive ion etching (RIE) was used to fabricate the curves which were subsequently buried in InP to reduce optical losses and to control the number of lateral guided modes. Losses as low as 1.1 dB for 200 mu m radius of curvature and 0.3 dB for 300 mu m radius of curvature have been measured using TE-polarised light at 1.553 mu m wavelength.
  • Keywords
    III-V semiconductors; gallium arsenide; indium compounds; integrated optics; optical interconnections; optical waveguide components; sputter etching; vapour phase epitaxial growth; 1.1 to 0.3 dB; 1.553 micron; 200 to 300 micron; GaInAsP-InP; MOVPE; RIE; TE-polarised light; dry etching; low-loss buried optical waveguide bends; optical losses; radius of curvature; reactive ion etching; single-mode buried optical waveguide bends; wavelength;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19890603
  • Filename
    31926