DocumentCode
1171758
Title
Modeling of multilevel structures: a general method for analyzing stress evolution during processing
Author
Cifuentes, Arturo O. ; Shareef, Iqbal A.
Author_Institution
IBM Corp., Yorktown Heights, NY, USA
Volume
5
Issue
2
fYear
1992
fDate
5/1/1992 12:00:00 AM
Firstpage
128
Lastpage
137
Abstract
This work presents a general modeling technique for following the evolution of the stress field during the manufacturing of multilevel structures. This technique combines the finite element method with a modeling strategy that uses artificial nodes to simulate material interfaces. It can be applied to both linear and nonlinear structures. The main advantage of this approach is that it allows one to account for all topological and geometric changes during the manufacturing process, as well as the residual stresses introduced at each stage. Its implementation is very straightforward since it is compatible with current finite element technology and most commercial codes. The usefulness of this technique is illustrated with an example concerning an encapsulated copper line
Keywords
VLSI; finite element analysis; integrated circuit technology; metallisation; stress analysis; Cu encapsulated line; artificial nodes; finite element method; modeling strategy; modeling technique; multilevel structures modelling; residual stresses; stress evolution analysis; stress evolution during processing; Aluminum; Copper; Finite element methods; Geometry; Glass; Manufacturing processes; Residual stresses; Temperature; Thermal expansion; Thermal stresses;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.136274
Filename
136274
Link To Document