• DocumentCode
    1171758
  • Title

    Modeling of multilevel structures: a general method for analyzing stress evolution during processing

  • Author

    Cifuentes, Arturo O. ; Shareef, Iqbal A.

  • Author_Institution
    IBM Corp., Yorktown Heights, NY, USA
  • Volume
    5
  • Issue
    2
  • fYear
    1992
  • fDate
    5/1/1992 12:00:00 AM
  • Firstpage
    128
  • Lastpage
    137
  • Abstract
    This work presents a general modeling technique for following the evolution of the stress field during the manufacturing of multilevel structures. This technique combines the finite element method with a modeling strategy that uses artificial nodes to simulate material interfaces. It can be applied to both linear and nonlinear structures. The main advantage of this approach is that it allows one to account for all topological and geometric changes during the manufacturing process, as well as the residual stresses introduced at each stage. Its implementation is very straightforward since it is compatible with current finite element technology and most commercial codes. The usefulness of this technique is illustrated with an example concerning an encapsulated copper line
  • Keywords
    VLSI; finite element analysis; integrated circuit technology; metallisation; stress analysis; Cu encapsulated line; artificial nodes; finite element method; modeling strategy; modeling technique; multilevel structures modelling; residual stresses; stress evolution analysis; stress evolution during processing; Aluminum; Copper; Finite element methods; Geometry; Glass; Manufacturing processes; Residual stresses; Temperature; Thermal expansion; Thermal stresses;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.136274
  • Filename
    136274