• DocumentCode
    1172039
  • Title

    Preoxidation treatment using HCl/HF vapor

  • Author

    Wong, Man ; Liu, David K Y ; Moslehi, Mehrdad M. ; Reed, David W.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • Volume
    12
  • Issue
    8
  • fYear
    1991
  • Firstpage
    425
  • Lastpage
    426
  • Abstract
    Replacement of the conventional two-step sequence of aqueous HF dummy oxide strip and wet clean by a one-step vapor phase HCl/HF/H/sub 2/O strip was investigated. Results indicated improvements in the electrical endurance of grown silicon dioxide and that the vapor mixture containing HCl was effective in reducing the detrimental effects caused by deliberately introduced contaminants. Compared with the conventional wet cleans, a 20% improvement in oxide lifetime was observed. Further improvements should be possible with proper optimization of the quantative composition or the constituents of the vapor.<>
  • Keywords
    elemental semiconductors; etching; hydrogen compounds; oxidation; silicon; silicon compounds; HCl-HF-H/sub 2/O vapor etch; Si chip preclean; SiO/sub 2/ etching; electrical endurance; oxide lifetime; preoxidation treatment; semiconductors; Breakdown voltage; Capacitors; Current density; Design for quality; Etching; Hafnium; Human computer interaction; Silicon compounds; Stress; Strips;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.119153
  • Filename
    119153