DocumentCode
1172039
Title
Preoxidation treatment using HCl/HF vapor
Author
Wong, Man ; Liu, David K Y ; Moslehi, Mehrdad M. ; Reed, David W.
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
Volume
12
Issue
8
fYear
1991
Firstpage
425
Lastpage
426
Abstract
Replacement of the conventional two-step sequence of aqueous HF dummy oxide strip and wet clean by a one-step vapor phase HCl/HF/H/sub 2/O strip was investigated. Results indicated improvements in the electrical endurance of grown silicon dioxide and that the vapor mixture containing HCl was effective in reducing the detrimental effects caused by deliberately introduced contaminants. Compared with the conventional wet cleans, a 20% improvement in oxide lifetime was observed. Further improvements should be possible with proper optimization of the quantative composition or the constituents of the vapor.<>
Keywords
elemental semiconductors; etching; hydrogen compounds; oxidation; silicon; silicon compounds; HCl-HF-H/sub 2/O vapor etch; Si chip preclean; SiO/sub 2/ etching; electrical endurance; oxide lifetime; preoxidation treatment; semiconductors; Breakdown voltage; Capacitors; Current density; Design for quality; Etching; Hafnium; Human computer interaction; Silicon compounds; Stress; Strips;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.119153
Filename
119153
Link To Document