Title :
On the relationship between yield and cycle time in semiconductor wafer fabrication
Author :
Wein, Lawrence M.
Author_Institution :
Sloan Sch. of Manage., MIT, Cambridge, CA, USA
fDate :
5/1/1992 12:00:00 AM
Abstract :
The author derives a relationship between the mean amount of time wafers spend in the fab and the mean production rate of nondefective die, assuming the number of defects per die is a Poisson random variable whose mean varies linearly with the amount of time the wafer spends in the fab
Keywords :
clean rooms; integrated circuit manufacture; Poisson random variable; cycle time; mathematical model; mean production rate; nondefective die; number of defects per die; semiconductor wafer fabrication; tradeoff; yield; Contamination; Electronics industry; Fabrication; Government; Industrial relations; Manufacturing industries; Semiconductor device manufacture; Semiconductor device modeling; Textile industry; Throughput;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
