DocumentCode :
1173236
Title :
New hot-carrier degradation mode in PMOSFETs with W gate electrodes
Author :
Matsuhashi, H. ; Hayashi, T. ; Nishikawa, S.
Author_Institution :
Oki Electr. Ind. Co. Ltd., Tokyo, Japan
Volume :
12
Issue :
10
fYear :
1991
Firstpage :
539
Lastpage :
541
Abstract :
Hot-carrier degradation of W gate PMOSFETs, which are surface-channel devices because of the work function of W, has been investigated in comparison with polycide (WSi/sub x//n/sup +/ poly-Si) ones. In W gate PMOSFETs, transconductance g/sub m/ and threshold voltage V/sub th/ decrease on the drain avalanche hot-carrier (DAHC) stress, and Delta g/sub m//g/sub m0/ and Delta V/sub th/ become minimum at V/sub G/ equivalent to V/sub D//2. By using the charge-pumping technique, it is found that, after stressing at the same stress condition, the interface state density of W gate devices is about 10 times larger than that of polycide ones but the densities of trapped electrons are almost equal. These results indicate that the difference of hot-carrier degradation between W and polycide gate devices is mainly caused by the difference of the interface state density.<>
Keywords :
hot carriers; insulated gate field effect transistors; interface electron states; tungsten; W gate PMOSFETs; W gate electrodes; W-SiO/sub 2/-Si; charge-pumping technique; drain avalanche hot-carrier stress; hot-carrier degradation mode; interface state density; p-channel MOSFETs; surface-channel devices; threshold voltage; transconductance; Charge pumps; Degradation; Drain avalanche hot carrier injection; Electrodes; Hot carriers; Interface states; MOSFETs; Stress; Threshold voltage; Transconductance;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.119182
Filename :
119182
Link To Document :
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