Title :
Pool Boiling Experiments on a Nano-Structured Surface
Author :
Ahn, Hee Seok ; Sathyamurthi, Vijaykumar ; Banerjee, Debjyoti
Author_Institution :
Mech. Eng. Dept., Texas A & M Univ., College Station, TX
fDate :
3/1/2009 12:00:00 AM
Abstract :
The effect of nano-structured surfaces on pool boiling was investigated. Saturated and subcooled pool boiling experiments were performed on a horizontal heater surface coated with vertically aligned multiwalled carbon nanotubes (MWCNTs). MWCNTs were synthesized using the chemical vapor deposition (CVD) process. In this paper, MWCNT forests of two distinctly different heights (Type A: 9-mum height, and Type B: 25-mu m height) were synthesized separately on silicon wafers. PF-5060 was used as the test liquid. The results show that Type-B MWCNTs yield distinctly higher heat fluxes under subcooled and saturated conditions for both nucleate and film boiling. Type-A MWCNTs provide similar enhancement in nucleate boiling (as Type-B) for both saturated and subcooled conditions. Type-B MWCNTs enhanced critical heat flux (CHF) by 40%. Increasing the height of the MWCNTs is also found to extend the wall super heat required for CHF. In contrast, Type-A MWCNTs provide only marginal enhancement in film boiling compared to bare silicon wafer, for both saturated and subcooled film boiling. Type-B MWCNTs enhanced the heat flux in the film boiling regime for the Leidenfrost point by 175% (compared to bare silicon wafer).
Keywords :
CVD coatings; carbon nanotubes; film boiling; heat transfer; nanostructured materials; thermal management (packaging); C; CVD; Si; chemical vapor deposition; critical heat flux; film boiling; horizontal heater surface; nanostructured surface; saturated subcooled pool boiling experiments; silicon wafers; size 25 mum; size 9 mum; thermal management; vertically aligned multiwalled carbon nanotubes; Carbon nanotube; Leidenfrost point; cooling; critical heat flux (CHF); film boiling; multiwalled; nucleate boiling;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2009.2013980