Title :
Compositional and failure analysis of polymers - a practical approach [Book Review]
Keywords :
Additives; Book reviews; Conducting materials; Conductive adhesives; Curing; Failure analysis; Mechanical factors; Microelectronics; Polymer films; Stability;
Journal_Title :
Electrical Insulation Magazine, IEEE
DOI :
10.1109/MEI.2003.1192039
