DocumentCode :
1174489
Title :
Gate Length and Performance Scaling of Undoped-Body Extremely Thin SOI MOSFETs
Author :
Majumdar, Amlan ; Wang, Xinlin ; Kumar, Arvind ; Holt, Judson R. ; Dobuzinsky, David ; Venigalla, Raj ; Ouyang, Christine ; Koester, Steven J. ; Haensch, Wilfried
Author_Institution :
IBM Res. Div., T J. Watson Res. Center, Yorktown Heights, NY
Volume :
30
Issue :
4
fYear :
2009
fDate :
4/1/2009 12:00:00 AM
Firstpage :
413
Lastpage :
415
Abstract :
In this letter, we show that undoped-body extremely thin SOI (ETSOI) MOSFETs with SOI thickness in the 4-6-nm range have excellent short-channel control down to 20-25-nm gate lengths, suitable for the 22-nm technology node and beyond. We demonstrate that 6-nm-thin ETSOI devices can deliver high drive currents required for logic applications. Finally, we bring to fore the need for improvements in etch and doping processes to reduce series resistance of 4-nm-thin ETSOI devices in order to make them a viable option for the 15-nm technology node.
Keywords :
MOSFET; electric resistance; etching; semiconductor doping; silicon-on-insulator; SOI thickness; Si; doping processes; drive currents; etch processes; gate lengths; series resistance; size 4 nm to 6 nm; undoped-body extremely thin SOI MOSFET; CMOSFETs; fully depleted SOI (FDSOI);
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2009.2014086
Filename :
4787154
Link To Document :
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