Title :
Recycling method for used slurry by annealed filtering
Author :
Seo, Y.-J. ; Kim, N.-H. ; Lee, W.-S.
Author_Institution :
Dept. of Electr. & Electron. Eng., Daebul Univ., Chonnam, South Korea
Abstract :
Abrasive powder was collected and annealed so that it could be used to promote the mechanical strength of reduced abrasion force. Chemical mechanical polishing characteristics between self-developed KOH-based silica abrasive slurry and original slurry were investigated. Experimental results showed comparable removal rate and good planarity with commercial products.
Keywords :
abrasion; annealing; chemical mechanical polishing; mechanical strength; potassium compounds; powders; recycling; silicon compounds; slurries; KOH based silica abrasive slurry; KOH-SiO2; abrasive powder; annealed filtering; chemical mechanical polishing characteristics; commercial products; mechanical strength; recycling method; reduced abrasion force;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20045730
