DocumentCode
1176146
Title
Wire bonded interdigital capacitor
Author
Casares-Miranda, Francisco P. ; Otero, Pablo ; Márquez-Segura, E. ; Camacho-Peñalosa, C.
Author_Institution
Dipt. Ingenieria de Comunicaciones, Univ. de Malaga, Spain
Volume
15
Issue
10
fYear
2005
Firstpage
700
Lastpage
702
Abstract
Interdigital capacitors (IDCs) are convenient capacitance devices in microstrip circuits, even if only low capacitance values can be achieved. Nevertheless, undesired resonances degrade their performance when frequency increases. Short circuits across the end of alternate fingers of the IDC improve its high frequency response by eliminating that drawback. Simulated and measured results are presented.
Keywords
capacitors; interconnections; microstrip components; capacitance device; microstrip circuits; microwave passive circuits; short circuits; wire bonded interdigital capacitor; Bonding; Capacitance; Capacitors; Circuits; Degradation; Fingers; Frequency; Microstrip; Resonance; Wire; Interdigital capacitor (IDC); microwave passive circuits; wire bonded interdigital capacitor (WBIDC); wire bonding;
fLanguage
English
Journal_Title
Microwave and Wireless Components Letters, IEEE
Publisher
ieee
ISSN
1531-1309
Type
jour
DOI
10.1109/LMWC.2005.856835
Filename
1512227
Link To Document