• DocumentCode
    1176146
  • Title

    Wire bonded interdigital capacitor

  • Author

    Casares-Miranda, Francisco P. ; Otero, Pablo ; Márquez-Segura, E. ; Camacho-Peñalosa, C.

  • Author_Institution
    Dipt. Ingenieria de Comunicaciones, Univ. de Malaga, Spain
  • Volume
    15
  • Issue
    10
  • fYear
    2005
  • Firstpage
    700
  • Lastpage
    702
  • Abstract
    Interdigital capacitors (IDCs) are convenient capacitance devices in microstrip circuits, even if only low capacitance values can be achieved. Nevertheless, undesired resonances degrade their performance when frequency increases. Short circuits across the end of alternate fingers of the IDC improve its high frequency response by eliminating that drawback. Simulated and measured results are presented.
  • Keywords
    capacitors; interconnections; microstrip components; capacitance device; microstrip circuits; microwave passive circuits; short circuits; wire bonded interdigital capacitor; Bonding; Capacitance; Capacitors; Circuits; Degradation; Fingers; Frequency; Microstrip; Resonance; Wire; Interdigital capacitor (IDC); microwave passive circuits; wire bonded interdigital capacitor (WBIDC); wire bonding;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2005.856835
  • Filename
    1512227