Average power handling capability of finite-ground thin-film microstrip lines over ultra-wide frequency ranges

Author

Yin, Wen-Yan ; Dong, X.T. ; Mao, Junfa ; Li, Le-Wei

Author_Institution

Sch. of Electron., Shanghai Jiao Tong Univ., China

Volume

15

Issue

10

fYear

2005

Firstpage

715

Lastpage

717

Abstract

Based on the distributed parameters extracted and the thermal model proposed to calculate the rise in temperature, the average power handling capabilities (APHCs) of finite-ground thin-film microstrip lines (TFMLs) on benzocyclobutene (BCB) and polyimide films over ultra-wide frequency ranges are investigated. Numerical results are given to show the enhancement in APHCs achieved by choosing appropriate metallization conductivity and thickness, BCB thermal conductivity, and polyimide thickness etc. It is believed that the proposed approach is useful in the design of practical TFML circuits.

Keywords

integrated circuit metallisation; microstrip lines; polymer films; thermal conductivity; thin film circuits; BCB thermal conductivity; TFML circuits; attenuation constant; average power handling capability; benzocyclobutene; distributed parameters; metallization conductivity; polyimide films; thermal model; thin-film microstrip lines; ultra-wide frequency range; Attenuation; Capacitance; Dielectric substrates; Frequency; Inductance; Metallization; Microstrip; Polyimides; Thermal conductivity; Transistors; Attenuation constant; average power handling capability (APHC); benzocyclobutene (BCB); distributed parameters; finite-ground thin-film microstrip lines (FG-TFMLs); thermal conductivity;

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2005.856829

Filename

1512232