Title :
A Frequency-Agile RF Frontend Architecture for Multi-Band TDD Applications
Author :
Goswami, Suparna ; Kim, Heonhwan ; Dawson, Joel L.
Author_Institution :
Massachusetts Inst. of Technol. (MIT), Cambridge, MA, USA
Abstract :
Emerging wireless standards specify dozens of bands spanning several octaves, which need to be supported in form-factor and energy constrained mobile devices targeting ubiquitous connectivity. However, in current multi-band radio implementations, significant redundancy is still the norm in the RF frontend. This work introduces an improved architecture for multi-band, time-division duplexed (TDD) radios, which replaces multiple narrowband frontend components with a frequency-agile solution, tunable over a wide frequency range. A highly digital architecture is adopted, leading to a fully integrated solution wherein both efficiency and achievable frequency range benefit from CMOS scaling. A prototype is integrated in 45 nm SOI CMOS. Peak PA output power is 27.7 ±0.5 dBm from 1.3 to 3.3 GHz, with up to 30% total efficiency at 2 V. For TDD LTE applications, better than -30 dBc ACLR and -30 dB EVM is measured with 64 QAM, 20 MHz signals from 1.44 to 3.41 GHz, with up to 17.2% average efficiency and 23.4 dBm average power. The LNA achieves AV ≥ 14 dB, NF = 4.4 ±1.6 dB and IIP 3 ≥ -7 dBm from 1.3 to 3.3 GHz while drawing just 6 mA from 1 V. The demonstrated frequency range covers a total of 11 TDD bands .
Keywords :
CMOS integrated circuits; Long Term Evolution; mobile handsets; quadrature amplitude modulation; time division multiplexing; 64 QAM; ACLR; CMOS scaling; EVM; SOI CMOS; TDD LTE; TDD bands; current 6 mA; digital architecture; energy constrained mobile devices; form-factor mobile devices; frequency 1.3 GHz to 3.3 GHz; frequency 1.44 GHz to 3.41 GHz; frequency-agile RF frontend architecture; frequency-agile solution; multiband TDD; multiband radio implementations; multiband time-division duplexed radios; narrowband frontend components; size 45 nm; ubiquitous connectivity; voltage 11 V; wireless standards; CMOS integrated circuits; Computer architecture; Impedance; Microprocessors; Power generation; Radio frequency; Switches; 4G wireless communication; low-noise amplifiers; power amplifiers; silicon on insulator technology; software radio; time division multiplexing; wireless LAN;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2014.2339318