Cubic millimeter power inductor fabricated in batch-type wafer technology

Author

Saidani, Menouer ; Gijs, Martin A M

Author_Institution

Inst. of Microelectron. & Microsystems, Swiss Fed. Inst. of Technol., Lausanne, Switzerland

Volume

12

Issue

2

fYear

2003

fDate

4/1/2003 12:00:00 AM

Firstpage

172

Lastpage

178

Abstract

A hybrid technology for the realization of three-dimensional (3-D) miniaturized power inductors is presented. Our devices consist of planar Cu coils on polyimide substrates, and mm-size ferrite magnetic cores, obtained by three-dimensional micro-patterning of ferrite wafers using powder blasting. The coils are realized using an in-house developed high-resolution polyimide spinning and Cu electroplating process. Winding widths down to 5 μm have been obtained and total device volumes are ranging between 1.5 and 10 mm³. Inductive and resistive properties are characterized as a function of frequency; inductance values in the 100 μH range have been obtained.

Keywords

coils; copper; electroplating; magnetic cores; photolithography; planarisation; powder technology; power electronics; power inductors; windings; 3D micro-patterning; 3D miniaturized power inductors; 5 micron; Cu; Cu electroplating process; batch-type wafer technology; cubic millimeter power inductor; ferrite wafers; high-resolution flex-foil process; high-resolution polyimide spinning; inductive properties; microfabrication; mm-size ferrite magnetic cores; planar Cu coils; polyimide substrates; powder blasting; resistive properties; Coils; Ferrites; Frequency; Inductance; Inductors; Magnetic cores; Millimeter wave devices; Polyimides; Powders; Spinning;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/JMEMS.2002.807472

Filename

1192711