Title :
InP-based 1.3-1.6-μm VCSELs with selectively etched tunnel-junction apertures on a wavelength flexible platform
Author :
Feezell, D. ; Buell, D.A. ; Coldren, L.A.
Author_Institution :
Dept. of Mater. Sci., Univ. of California, Santa Barbara, CA, USA
Abstract :
The authors demonstrate a wavelength flexible platform for the production of long-wavelength vertical-cavity surface-emitting lasers which provide full wavelength coverage from 1.3-1.6 μm. All-epitaxial InP-based devices with AsSb-based distributed Bragg reflectors were achieved through a common design, process, and growth technology at both the important telecommunications wavelengths of 1.3 and 1.5 μm. Thin selectively etched tunnel junctions were implemented as low-loss apertures and offer scalability to small device dimensions. Devices showed low threshold currents (<2 mA), near single-mode (SMSR>20 dB) operation, and high differential efficiency (>40% at 1.3 μm and >25% at 1.5 μm).
Keywords :
III-V semiconductors; aluminium compounds; distributed Bragg reflector lasers; etching; gallium arsenide; gallium compounds; indium compounds; laser cavity resonators; laser modes; semiconductor epitaxial layers; semiconductor lasers; surface emitting lasers; 1.3 to 1.6 mum; AlGaAsSb; AsSb-based reflectors; InP; InP-InAlAs; InP-based VCSEL; all-epitaxial InP-based devices; distributed Bragg reflectors; growth technology; long-wavelength lasers; low-loss apertures; reflector design; selectively etched tunnel-junction; single-mode operation; telecommunications wavelengths; tunnel-junction apertures; wavelength flexible platform; Apertures; Distributed Bragg reflectors; Etching; Process design; Production; Scalability; Surface emitting lasers; Surface waves; Threshold current; Vertical cavity surface emitting lasers; InP-based; long wavelength; molecular beam epitaxy; optical fiber communications; semiconductor laser processing; semiconductor lasers; tunnel junction; vertical-cavity surface-emitting lasers (VCSELs);
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2005.854357