• DocumentCode
    1178808
  • Title

    Combined linear and homomorphic deconvolutions for processing bandpass measurements [US flaw detection]

  • Author

    Kechter, George E. ; Achenbach, Jan D.

  • Author_Institution
    Battelle Columbus Labs., OH, USA
  • Volume
    39
  • Issue
    6
  • fYear
    1991
  • fDate
    6/1/1991 12:00:00 AM
  • Firstpage
    1300
  • Lastpage
    1304
  • Abstract
    The deconvolution presented is a combination of available techniques. It is effective for extracting the impulse response of individual flaws from ultrasonic data generated by flaw clusters. The technique requires output signals from both the flawed and unflawed systems. By combining linear deconvolution and homomorphic deconvolution, using the complex cepstrum, the desired impulse response can be extracted in cases where the signals contain overlapping wavelets. For the important case of bandpass signals, for which the complex cepstrum does not exist, the technique can still be applied by including a bandpass mapping in conjunction with homomorphic processing. Application of this combined approach to ultrasonic signals reflected from epoxy specimens produced the impulse response of a single cavity from measurements which were bandpass and contained overlapping signals from adjacent cavities. The recovered response, which compared well with the theoretical response of a single cavity, was sufficiently resolved to yield the radius of the spherical cavity
  • Keywords
    acoustic signal processing; flaw detection; polymers; ultrasonic materials testing; US flaw detection; bandpass mapping; bandpass measurements; complex cepstrum; epoxy specimens; homomorphic deconvolution; impulse response; linear deconvolution; spherical cavity; ultrasonic data; Cepstrum; Convolution; Data mining; Deconvolution; Fourier transforms; Linear systems; Signal mapping; Signal processing; Signal resolution; Ultrasonic variables measurement;
  • fLanguage
    English
  • Journal_Title
    Signal Processing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1053-587X
  • Type

    jour

  • DOI
    10.1109/78.136536
  • Filename
    136536