DocumentCode
1178808
Title
Combined linear and homomorphic deconvolutions for processing bandpass measurements [US flaw detection]
Author
Kechter, George E. ; Achenbach, Jan D.
Author_Institution
Battelle Columbus Labs., OH, USA
Volume
39
Issue
6
fYear
1991
fDate
6/1/1991 12:00:00 AM
Firstpage
1300
Lastpage
1304
Abstract
The deconvolution presented is a combination of available techniques. It is effective for extracting the impulse response of individual flaws from ultrasonic data generated by flaw clusters. The technique requires output signals from both the flawed and unflawed systems. By combining linear deconvolution and homomorphic deconvolution, using the complex cepstrum, the desired impulse response can be extracted in cases where the signals contain overlapping wavelets. For the important case of bandpass signals, for which the complex cepstrum does not exist, the technique can still be applied by including a bandpass mapping in conjunction with homomorphic processing. Application of this combined approach to ultrasonic signals reflected from epoxy specimens produced the impulse response of a single cavity from measurements which were bandpass and contained overlapping signals from adjacent cavities. The recovered response, which compared well with the theoretical response of a single cavity, was sufficiently resolved to yield the radius of the spherical cavity
Keywords
acoustic signal processing; flaw detection; polymers; ultrasonic materials testing; US flaw detection; bandpass mapping; bandpass measurements; complex cepstrum; epoxy specimens; homomorphic deconvolution; impulse response; linear deconvolution; spherical cavity; ultrasonic data; Cepstrum; Convolution; Data mining; Deconvolution; Fourier transforms; Linear systems; Signal mapping; Signal processing; Signal resolution; Ultrasonic variables measurement;
fLanguage
English
Journal_Title
Signal Processing, IEEE Transactions on
Publisher
ieee
ISSN
1053-587X
Type
jour
DOI
10.1109/78.136536
Filename
136536
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