Title :
Detection of hot spots in thin metal films via thermal noise measurements
Author :
Massiha, G.H. ; Chen, Tsong M. ; Scott, G.J.
Author_Institution :
Dept. of Electr. Eng., South Florida Univ., Tampa, FL, USA
Abstract :
A technique to detect local hot spots in thin aluminum films is discussed. Electromigration-damaged aluminum films of different dimensions have higher effective noise temperatures than undamaged films (good conductors) when they have the same environmental temperature and carry the same current density. The differences in noise temperature are attributed to film local joule heating associated with voids or poor film adhesion to the substrate.<>
Keywords :
aluminium; electromigration; metallic thin films; metallisation; thermal noise; Al films; IC interconnection; current density; electromigration; film adhesion; hot spot detection; local joule heating; noise temperatures; thermal noise; thin metal films; voids; Aluminum; Background noise; Conducting materials; Conductive films; Electromigration; Frequency; Noise measurement; Preamplifiers; Temperature distribution; Voltage;
Journal_Title :
Electron Device Letters, IEEE