• DocumentCode
    1179039
  • Title

    MEMS ultrasonic transducers for the testing of solids

  • Author

    Oppenheim, Irving J. ; Jain, Akash ; Greve, David W.

  • Author_Institution
    Carnegie Mellon Univ., Pittsburgh, PA, USA
  • Volume
    50
  • Issue
    3
  • fYear
    2003
  • fDate
    3/1/2003 12:00:00 AM
  • Firstpage
    305
  • Lastpage
    311
  • Abstract
    Arrays of capacitive diaphragm ultrasonic transducers could potentially be used for non-destructive ultrasonic testing and structural monitoring. In this paper, we consider the efficiency of coupling of these transducers to solid media. We show that efficient coupling can be realized by using a silicone coating as a coupling medium. We present the results of experimental characterization of ultrasonic transducers coupled to solids in this way. We show that these transducers can be used with piezoelectric emitting transducers within the range from 1 to 5 MHz, and we demonstrate the use of several transducers as a phased array to determine the direction and distance of an ultrasonic source.
  • Keywords
    capacitive sensors; condition monitoring; diaphragms; microsensors; piezoelectric transducers; ultrasonic materials testing; ultrasonic transducers; 1 to 5 MHz; MEMS ultrasonic transducers; capacitive diaphragm ultrasonic transducers; coupling medium; nondestructive ultrasonic testing; phased array; piezoelectric emitting transducers; silicone coating; solid media; structural monitoring; ultrasonic source; Costs; Inspection; Micromechanical devices; Nondestructive testing; Phased arrays; Piezoelectric transducers; Sensor arrays; Solids; Ultrasonic transducer arrays; Ultrasonic transducers; Acoustic Stimulation; Cementation; Electric Capacitance; Electrochemistry; Equipment Design; Equipment Failure Analysis; Materials Testing; Miniaturization; Models, Theoretical; Quality Control; Sensitivity and Specificity; Transducers; Ultrasonography;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/TUFFC.2003.1193624
  • Filename
    1193624