Packaging techniques for modern microelectronics equipment
Author :
Robertson, F.A.
Volume :
17
Issue :
10
fYear :
1971
fDate :
10/1/1971 12:00:00 AM
Firstpage :
406
Lastpage :
409
Abstract :
It is not easy for a designer to decide the form that electronic circuit packages should assume; this article explains packaging problems in the past, and presents a pattern of design for the future
