Title :
Modelling of thermal failure of metallic interconnects under electrostatic discharge transients
Author :
Amin, K.M. ; Fikry, W. ; Sabry, M.N. ; Ragai, H.F.
Author_Institution :
Egypt Air, Maintenance & Eng. Co., Cairo, Egypt
fDate :
9/15/2005 12:00:00 AM
Abstract :
Temperature dependence of metal electrical resistivity is taken into account in modelling of thermal failure of metallic interconnects under electrostatic discharge (ESD) events. SPICE-based electro-thermal modelling is used to calculate the maximum temperature rise in the interconnect during stress. New ESD design guidelines for interconnects, based on the threshold temperature of latent failure, are proposed to optimise the interconnect width.
Keywords :
electrical resistivity; electrostatic discharge; heat transfer; integrated circuit interconnections; integrated circuit reliability; optimisation; thermal analysis; transients; ESD design guidelines; electrostatic discharge transients; electrothermal modelling; heat transfer; integrated circuit interconnections; integrated circuit reliability; interconnect width optimisation; metal electrical resistivity; metallic interconnects; temperature dependence; thermal analysis; thermal failure modelling;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20052032
