• DocumentCode
    1179665
  • Title

    The collapse of current gain in multi-finger heterojunction bipolar transistors: its substrate temperature dependence, instability criteria, and modeling

  • Author

    Liu, William ; Khatibzadeh, Ali

  • Author_Institution
    Corporate R&D, Texas Instrum. Inc., Dallas, TX, USA
  • Volume
    41
  • Issue
    10
  • fYear
    1994
  • fDate
    10/1/1994 12:00:00 AM
  • Firstpage
    1698
  • Lastpage
    1707
  • Abstract
    One undesirable phenomenon observed when AlGaAs/GaAs heterojunction bipolar transistors (HBT´s) are operated under high power density is the collapse (of current gain). The collapse manifests itself by a distinct abrupt decrease of collector current in the transistor common-emitter current-voltage (I-V) characteristics. In this investigation, we study the substrate temperature dependence of the collapse. A unified equation is introduced to relate the collapse instability criterion with other thermal instability criteria proposed for silicon bipolar transistors. The effects of the thermal instability on the collapse behavior of 2-finger and 1-finger HBT´s are examined. We also present a numerical model to adequately describe the collapse in multi-finger HBT´s having arbitrary geometry. The I-V characteristics and regression plots of both ballasted and unballasted HBT´s are compared
  • Keywords
    III-V semiconductors; aluminium compounds; gallium arsenide; heterojunction bipolar transistors; power transistors; semiconductor device models; AlGaAs-GaAs; ballast; collapse instability; common-emitter current-voltage characteristics; current gain; multi-finger heterojunction bipolar transistors; numerical model; power density; regression plots; substrate temperature; thermal instability; Bipolar transistors; Circuits; Equations; Gallium arsenide; Heterojunction bipolar transistors; High power amplifiers; Power amplifiers; Silicon; Temperature dependence; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.324577
  • Filename
    324577