• DocumentCode
    118001
  • Title

    Graphene interconnect for nano scale circuits

  • Author

    Raja, P.S. ; Daniel, R. Joseph ; Thomas, R.M.

  • Author_Institution
    Dept. of E & I Eng., Annamalai Univ., Annamalai Nagar, India
  • fYear
    2014
  • fDate
    6-8 March 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The role of interconnect in an integrated circuit is to enable effective passing of clock and other signals in addition to providing power to various parts of the circuit on a chip. The advent of sub-quarter-micron IC technologies has forced dramatic changes in the design and manufacturing methodologies for integrated circuits and systems. The paradigm shift for interconnect which was once considered just parasitic but can now be a dominant factor for integrated circuit performance provided the greatest impetus for change of existing methodologies. Copper, which is presently used as the interconnect material. Cu interconnect dimensions begin to come into the range of mean free path of electron typically 40nm. This results in surface and grain boundary scattering. Owing to these scattering phenomena resistivity, of Cu begins to increase. This limitation of copper interconnects is driving research for alternative interconnect materials and technologies for next-generation ICs. Nanotubes, Graphene, and Nanowires and Carbon Nano Tubes are some of the new materials suggested as an alternate to overcome these problems. Here in this paper we have analysed the various properties of graphene to use as an interconnect. Graphene has been attracting wide attention owing to its superb electronic, thermal and mechanical properties.
  • Keywords
    carbon nanotubes; graphene; integrated circuit interconnections; nanofabrication; nanoribbons; nanowires; carbon nanotubes; design methodologies; grain boundary scattering; graphene interconnect; integrated circuit; manufacturing methodologies; nanoscale circuits; nanowires; next-generation IC; paradigm shift; subquarter-micron IC technologies; surface boundary scattering; Conductivity; Graphene; Immune system; Integrated circuit interconnections; Materials; Resistance; IC scaling; Interconnect; carbon nanotube; gate oxide; graphene; graphene nanoribbon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Green Computing Communication and Electrical Engineering (ICGCCEE), 2014 International Conference on
  • Conference_Location
    Coimbatore
  • Type

    conf

  • DOI
    10.1109/ICGCCEE.2014.6922393
  • Filename
    6922393