• DocumentCode
    1180145
  • Title

    Flip Chip Assembly - A New Thin Film Approach to Single-Crystal Logic Operators

  • Author

    Carr, E.Q.

  • Author_Institution
    Light Military Electronics Department General Electric Company Utica, New York
  • Issue
    0
  • fYear
    1963
  • Keywords
    Aluminum; Assembly; Degradation; Flip chip; Integrated circuit interconnections; Logic; Microelectronics; Packaging; Substrates; Transistors;
  • fLanguage
    English
  • Journal_Title
    Aerospace and Navigational Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0096-1957
  • Type

    jour

  • DOI
    10.1109/TANE.1963.4502276
  • Filename
    4502276
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1180145