Title :
3-D Integration Technologies [Scanning the Issue]
Author :
Campardo, Giovanni ; Ripamonti, G. ; Micheloni, Rino
Abstract :
This issue responds to the observation that only the surface of an integrated circuit is electrically active; it explores three-dimensional techniques to extend Moore´s Law by a variety of approaches including the thinning and stacking of chips.
Keywords :
Integrated circuit technology; Power system reliability; Special issues and sections; Thermal management; Three dimensional displays;
Journal_Title :
Proceedings of the IEEE
DOI :
10.1109/JPROC.2008.2007450
