Title :
Table of contents
Abstract :
The following topics are dealt with: advanced packaging; system integration; packaging materials and processes; packaging design and modeling; microwave and power electronics packaging; and solid state lighting packaging.
Keywords :
electronics packaging; lighting; microwave devices; power electronics; ICEPT; electronic packaging technology; microwave electronics packaging; packaging design; packaging materials; packaging processes; power electronics packaging; solid state lighting packaging;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922547
