DocumentCode
118185
Title
Table of contents
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
1
Lastpage
34
Abstract
The following topics are dealt with: advanced packaging; system integration; packaging materials and processes; packaging design and modeling; microwave and power electronics packaging; and solid state lighting packaging.
Keywords
electronics packaging; lighting; microwave devices; power electronics; ICEPT; electronic packaging technology; microwave electronics packaging; packaging design; packaging materials; packaging processes; power electronics packaging; solid state lighting packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922547
Filename
6922547
Link To Document