Effect of melting temperature and amount of the phase change material (PCM) on thermal performance of hybrid heat sinks

Thermal management of the electronic devices who work intermittently with the method of latent heat storage is regarded as one of the most prospective alternative passive thermal management solutions. In this paper, the thermal management performance of the hybrid heat sink with the bottom of the fins immersed in the phase change material (PCM) is studied experimentally. The effect of the melting temperature and the quantity of the PCM on the performance of the hybrid heat sink is examined. The results show that the high-melting-temperature based hybrid heat sink can help the chip maintain a safe temperature for a longer time and the time increases as the quantity of the PCM increases. However, when applied for the thermal management of the devices who work with a low power, the hybrid heat sink shows no advantages.