• DocumentCode
    1182286
  • Title

    Optical Analysis of Phosphor´s Location for High-Power Light-Emitting Diodes

  • Author

    Liu, Zongyuan ; Liu, Sheng ; Wang, Kai ; Luo, Xiaobing

  • Author_Institution
    Sch. of Mech. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan
  • Volume
    9
  • Issue
    1
  • fYear
    2009
  • fDate
    3/1/2009 12:00:00 AM
  • Firstpage
    65
  • Lastpage
    73
  • Abstract
    High-power-light-emitting-diode (LED) packaging is crucial for the development of solid-state lighting. Phosphor´s location could affect the LED packaging performance such as light extraction and correlated color temperature (CCT). This paper systematically analyzes first the effects of phosphor´s location on LED packaging performance. A two-light-source step computation method based on the Monte Carlo theory is developed, and five different optical structures are discussed. Results show that the location of phosphor has small impact on light extraction but could greatly affect CCT. Remote phosphor location presents higher light extraction than proximate phosphor location. However, the increase is slight, and too remote location could reduce light extraction. A convex phosphor layer has higher light extraction but lower yellow-blue ratio than a plane phosphor layer. Considering the significant variation of CCT, it is suggested that an optical structure with plane and remote phosphor location should be a suitable choice for LED packaging.
  • Keywords
    Monte Carlo methods; light emitting diodes; phosphors; semiconductor device packaging; LED lights; LED packaging; Monte Carlo theory; high-power light-emitting diodes; light extraction; phosphor; solid-state lighting; two-light-source step computation method; yellow-blue ratio; Laboratories; Light emitting diodes; Monte Carlo methods; Optical computing; Packaging; Performance analysis; Phosphors; Power engineering and energy; Solid state lighting; Temperature; Correlated color temperature (CCT); light extraction; light-emitting diodes (LEDs); packaging; phosphor;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2008.2010250
  • Filename
    4796377