• DocumentCode
    1182425
  • Title

    Thermal Fatigue Strength of Epoxy Supporting Insulators with Embedded Electrodes

  • Author

    Yamazaki, Toshiharu ; Kobayashi, Nobumitsu

  • Author_Institution
    Hamakawasaki Works, Toshiba Corporation
  • Issue
    7
  • fYear
    1985
  • fDate
    7/1/1985 12:00:00 AM
  • Firstpage
    1910
  • Lastpage
    1915
  • Abstract
    This paper concerns the thermal fatigue strength of "electrode-molding" supporting insulators. Residual stresses that develop through the molding process within epoxy resin which embed metallic and non-metallic electrodes are studied and their long- term reduction is numerically forecasted by the theory of linear viscoelasticity.
  • Keywords
    Dielectrics and electrical insulation; Electrodes; Epoxy resins; Fatigue; Geographic Information Systems; Residual stresses; Strain measurement; Temperature; Thermal stresses; Viscosity;
  • fLanguage
    English
  • Journal_Title
    Power Apparatus and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9510
  • Type

    jour

  • DOI
    10.1109/TPAS.1985.318756
  • Filename
    4113320