Title :
Standards for Tin Whisker Test Methods on Lead-Free Components
Author :
Shibutani, Tadahiro ; Osterman, Michael ; Pecht, Michael
Author_Institution :
Yokohama Nat. Univ., Yokohama
fDate :
3/1/2009 12:00:00 AM
Abstract :
Tin whiskers are widely recognized as being a reliability threat to lead-free electronic components. The current standards to assess the tin whisker susceptibility of lead-free finishes in electronic components are problematic. Key problems include lack of data collection, lack of agreement on proper techniques for measuring whisker length, lack of established acceleration transforms for prescribed tests, and disagreement over acceptance criteria. This paper overviews the tin whisker standards and then describes the problems listed above. Recommendations for improvements are then presented and discussed.
Keywords :
electronic equipment testing; electronics packaging; lead; reliability; standards; tin alloys; acceleration transforms; acceptance criteria; data collection; lead-free electronic components; reliability threat; tin whisker test methods; Bridge circuits; Electronic components; Electronic equipment testing; Electronics industry; Environmentally friendly manufacturing techniques; IEC standards; Information technology; Inspection; Surface finishing; Tin; Environmental test; lead-free electronics; standard; tin whisker;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2009.2013311