DocumentCode :
1182489
Title :
Standards for Tin Whisker Test Methods on Lead-Free Components
Author :
Shibutani, Tadahiro ; Osterman, Michael ; Pecht, Michael
Author_Institution :
Yokohama Nat. Univ., Yokohama
Volume :
32
Issue :
1
fYear :
2009
fDate :
3/1/2009 12:00:00 AM
Firstpage :
216
Lastpage :
219
Abstract :
Tin whiskers are widely recognized as being a reliability threat to lead-free electronic components. The current standards to assess the tin whisker susceptibility of lead-free finishes in electronic components are problematic. Key problems include lack of data collection, lack of agreement on proper techniques for measuring whisker length, lack of established acceleration transforms for prescribed tests, and disagreement over acceptance criteria. This paper overviews the tin whisker standards and then describes the problems listed above. Recommendations for improvements are then presented and discussed.
Keywords :
electronic equipment testing; electronics packaging; lead; reliability; standards; tin alloys; acceleration transforms; acceptance criteria; data collection; lead-free electronic components; reliability threat; tin whisker test methods; Bridge circuits; Electronic components; Electronic equipment testing; Electronics industry; Environmentally friendly manufacturing techniques; IEC standards; Information technology; Inspection; Surface finishing; Tin; Environmental test; lead-free electronics; standard; tin whisker;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2009.2013311
Filename :
4796402
Link To Document :
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