DocumentCode :
1182566
Title :
Analysis and evaluation of multisite testing for VLSI
Author :
Hashempour, Hamidreza ; Meyer, Fred J. ; Lombardi, Fabrizio
Author_Institution :
IC Dev. & Appl. Res., LTX Corp., San Jose, CA, USA
Volume :
54
Issue :
5
fYear :
2005
Firstpage :
1770
Lastpage :
1778
Abstract :
This paper deals with multisite testing of VLSI chips in a manufacturing environment. Multisite testing is analyzed and evaluated using device-under-test (DUT) parameters (such as yield and average number of faults per DUT) as well as test process features (such as number of channels, fault coverage, and touchdown time for the head). The presence of idle time periods and their impact on the multisite test time is analyzed in depth. Two hybrid testing scenarios which combine built-in self-test (BIST) and automatic test equipment (ATE) are proposed and analytical models are provided to establish the corresponding multisite test time. It is shown that a hybrid approach based on screening chips through a BIST stage improves the performance of multisite test and allows a better utilization of channels in the head of an ATE.
Keywords :
VLSI; automatic test equipment; built-in self test; integrated circuit testing; integrated circuit yield; ATE; BIST; DUT; VLSI; automatic test equipment; built-in self-test; device-under-test; fault coverage; hybrid testing; multisite testing; Automatic test equipment; Automatic testing; Built-in self-test; Circuit faults; Circuit testing; Fault diagnosis; Integrated circuit testing; Radio frequency; Radiofrequency identification; Very large scale integration; Automatic test equipment (ATE); built-in self test (BIST); fault coverage; multisite testing; yield;
fLanguage :
English
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9456
Type :
jour
DOI :
10.1109/TIM.2005.855099
Filename :
1514625
Link To Document :
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