Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application

Author

Sitek, Janusz ; Koscielski, Marek ; Yan Zhang ; Jing-yu Fan ; Shiwei Ma ; Johan Liu

Author_Institution

Tele & Radio Res. Inst., Warsaw, Poland

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

151

Lastpage

154

Abstract

The results of investigations of new compositions of electrically conductive adhesives (ECA) for printed electronics applications with and without nano-additives are presented. The studies covered the influence of nano additives on mechanical properties and reliability of interconnects made by elaborated, improved composition of the ECA based on primary conclusions. The obtained results showed that nano additives influence significantly and positively on mechanical properties of ECA joints, but their impact on the reliability properties of joints manufactured in low temperatures is much lower or even negative.

Keywords

adhesives; conducting materials; interconnections; mechanical properties; nanostructured materials; reliability; substrates; ECA; elastic substrates; electrically conductive adhesives; interconnect reliability; joint reliability properties; low temperatures; mechanical properties; nanoadditives; printed electronics; Additives; Consumer electronics; Curing; Joints; Mechanical factors; Reliability; Substrates; Electrically conductive adhesives; mechanical properties; nano additives; printed electronics; reliability of interconnects;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922625

Filename

6922625