Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application

The results of investigations of new compositions of electrically conductive adhesives (ECA) for printed electronics applications with and without nano-additives are presented. The studies covered the influence of nano additives on mechanical properties and reliability of interconnects made by elaborated, improved composition of the ECA based on primary conclusions. The obtained results showed that nano additives influence significantly and positively on mechanical properties of ECA joints, but their impact on the reliability properties of joints manufactured in low temperatures is much lower or even negative.