Title :
Chip cooling with carbon nanotube heat sink
Author :
Zhenlong Huang ; Taisong Pan ; Min Gao ; Yuan Lin
Author_Institution :
State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
In this paper, lightweight heat sinks based on carbon nanotubes (CNTs) are presented. CNTs were attached on the surface of silicon chips and their heat dissipation performance were monitored. As the morphology of heat sinks is an important factor for the heat dissipation efficiency, two types of CNTs, CNT arrays and sponge CNTs, were used here. Besides, the influence of airflow on the two kinds of CNTs based heat sink was observed by controlling the wind speed. This work gives an excellent reference for a low-cost and high-performance micro-heat sink in the future.
Keywords :
carbon nanotubes; chip scale packaging; cooling; heat sinks; airflow; carbon nanotube heat sink; chip cooling; heat dissipation; lightweight heat sinks; silicon chips; wind speed; Carbon nanotubes; Electrodes; Heat sinks; Resistance heating; Silicon; Temperature sensors; CNT arrays; heat dissipation; heat sink; sponge CNTs;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922632
