Analysis of stress and strain distribution on pad during bump bonding process

Author

Tang Wenliang ; Huang Chunyue ; Li Tianming ; Liang Ying ; Xiong Guoji ; Wu Song ; Li Chunquan ; Ning Zhongping

Author_Institution

Sch. of Electro-Mech. Eng., Guilin Univ. of Electron. Technol., Guilin, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

219

Lastpage

222

Abstract

The finite element model of bump bonding is built and loads with conditions of bonding time, bonding pressure and bonding power at the same time, and the stress and strain analysis of the pad will take place using this bump bonding finite element model. The result show that: the stress and strain distribution of the pad is not even and increasing with the time, the largest stress and strain all locate the bonding edge, meanwhile, the small stress and strain all locate the bonding centre and basically remain unchanged in the bonding process, a stress and strain gradient from the bonding centre to the bonding edge appear in the pad. The distribution of stress and strain of pad is reflected from the bump bonding conditions.

Keywords

bonding processes; finite element analysis; stress analysis; bonding centre location; bonding edge location; bonding power; bonding pressure; bonding time; bump bonding process; finite element model; pad; strain gradient distribution analysis; stress gradient distribution analysis; Bonding; Educational institutions; Finite element analysis; Load modeling; Strain; Stress; Ultrasonic imaging; bump bonding; pad; strain; stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922640

Filename

6922640