Title :
The improvement of soldering process of new power module packaging material with large soldering area
Author :
Jun Zhang ; Bin-bin Zhang ; Yun-yan Liu ; Jing-ming Fei ; Cheng-an Wan
Author_Institution :
Beijing Spacecrafts, China Acad. of Space Technol., Beijing, China
Abstract :
With the development of materials technology, more and more high-performance materials can be used for power modules. DBC(Direct Bonded Copper) ceramic plates and Al-SiC composite are two most excellent materials among them. DBC power circuit board + AlSiC composite shell is a very good solution to form the thermal path of the power modules. Because the characteristics of the materials, the module is lighter, more reliable and have higher power density. This paper focus on the application of new materials in power modules, improve the solder process to meet the requirements of the actual products, which´s solder area mostly larger than 50mm×50mm.
Keywords :
aluminium compounds; bonding processes; power semiconductor devices; semiconductor device packaging; silicon compounds; soldering; AlSiC; DBC ceramic plates; DBC power circuit board; aluminium-silicon carbide composite; aluminium-silicon carbide composite shell; direct-bonded copper ceramic plates; high-performance materials; power density; power module packaging material; soldering area; soldering process improvement; thermal path; Coatings; Force; Multichip modules; Soldering; Substrates; Surface treatment;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922643
