Title :
Thermal property analysis of boron nitride-filled glass-fiber reinforced polymer composites
Author :
Zhang Jingyu ; Zeng Xiaoliang ; Sun Rong ; Xu Jian-bin
Author_Institution :
Shenzhen Electron. Packaging Mater. Eng. Lab., Shenzhen Inst. of Adv. Technol., Shenzhen, China
Abstract :
Glass fibers-reinforced BT resins composites (GFRBT) filled with the hexagonal boron nitride (h-BN) ranging from 20 to 80 wt% were prepared. The effect of BN content on the thermal conductivity and thermal stability of GFRBT was invesitigated. When weight fractions were no more than 60 wt%, the formation of BN network was contributed to the thermal conductivity, which showed an increasing with the increase of BN loadings. The thermal conductivity increased to 1.60 W/m.k when GFRBT filled by 60 wt% BN. However, further increasing of BN loadings led to a decreased thermal conductivity due to the increasing voids, defects and deteriorating film quality. The thermal degradation results indicated the initial decomposing temperatures and the maximum decomposition point shifted to higher temperature, which rose to 339 °C and 420 °C when GFRBT filled by 60 wt%, indicating that the thermal stability of GFRBT composites was enhanced by the addition of BN. GFRBT filled by BN with high thermal conductivity and excellent thermal stability should be taken into account the potential applications in the advanced packaging.
Keywords :
boron compounds; flip-chip devices; glass fibre reinforced plastics; thermal conductivity; thermal stability; BN loadings; BN network; GFRBT composites; advanced packaging; boron nitride-filled glass-fiber reinforced polymer composites; decomposing temperatures; defects; film quality deterioration; flip chips; glass fiber-reinforced BT resins composites; hexagonal boron nitride; maximum decomposition point; thermal conductivity; thermal degradation; thermal property analysis; thermal stability; voids; weight fractions; Boron; Conductivity; Electronic packaging thermal management; Resins; Surface morphology; Thermal conductivity; Thermal stability; boron nitride; fiber-reinforced polymer; thermal properties;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922655