• DocumentCode
    118332
  • Title

    High performance electrical conductive composites with ultralow percolation threshold

  • Author

    Xinfeng Zhang ; Yuen, Matthew Ming-Fai

  • Author_Institution
    Dept. of Mech. & Aerosp. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
  • fYear
    2014
  • fDate
    12-15 Aug. 2014
  • Firstpage
    306
  • Lastpage
    309
  • Abstract
    Particle-laiden polymer composites are a broad range of functional materials. Most of the polymer composite properties are strongly dependent on the filler loading level, which typically have an abrupt change near the critical filler loading. This phenomenon has been widely investigated and theoretically modeled by percolation theory. Generally, controlling the percolation threshold became a dominating approach to adjust the percolation properties of a composite and have attracted intensive interests. Here we report a generized strategy to control over the percolative properties in polymer composite. The percolation threshold of the composite <;4 v% was demonstrated in polymer composite by using the commercially available microparticles, comparing to a threshold value of ~18 v% in a conventional composite. For the electrically conductive composite, a reduction of 40 wt% of filler loading was achieved while keeping its conductivity. The percolation threshold controls not only increase the percolation properties of the electrical conductivity, but also the thermal conductivity and dielectric properties of the composites. The strategy described can be implemented in most of the current polymer composite manufacturing processes. The findings reported here are expected to revolutionize the conventional fields of composite materials.
  • Keywords
    conducting materials; conducting polymers; dielectric materials; filled polymers; filler metals; percolation; thermal conductivity; dielectric property; electrical conductive composite; filler loading level; manufacturing processing; microparticle; particle-laiden polymer composite; thermal conductivity; ultralow percolation threshold; Conductivity; Fluids; Jamming; Loading; Polymers; Silver; Suspensions; capillary force; electrical conductive composite; jamming; percolation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
  • Conference_Location
    Chengdu
  • Type

    conf

  • DOI
    10.1109/ICEPT.2014.6922660
  • Filename
    6922660