Title :
Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics
Author :
Yarong Chen ; Zongpeng He ; Zhenming Zhang ; Meng Yang ; Rong An
Author_Institution :
Beijing Spacecrafts, Beijing, China
Abstract :
The shearing strength and the void ratio of serial solder joints are discussed in this paper. Pb-containing solders, Sn-90Pb, Sn-95Pb, Sn-37Pb and Sn-3.0Ag-0.5Cu Pb-free are soldered with MoCu substrate using vacuum soldering. Results show that, Sn-90Pb, Sn-95Pb solder joints have many voids in the joint interface, and resulting low shearing strength. Sn-37Pb and Sn-3.0Ag-0.5Cu solder joints have less voids and larger shearing strength. The Sn-3.0Ag-0.5Cu solder joint has the largestlow shearing strength shear strength in all those 4 kinds of solders.
Keywords :
copper alloys; lead alloys; shear strength; silver alloys; soldering; solders; space vehicle electronics; tin alloys; voids (solid); MoCu; Pb; SnAgCu; joint interface; lead-containing solders; lead-free solder joints; low shearing strength; mechanical property; serial solder joints; space power electronics; vacuum soldering; void ratio; Aluminum oxide; Ceramics; Coatings; Reliability; Shearing; Soldering; Substrates;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922668
