Research on factors influencing the board level product quality

There are a variety of factors influencing the board level product quality. This paper mainly studies the soldering joint quality and the first pass yield from the components, printed board, design, technology, materials and other aspects. The test is divided into two parts, i.e. the deformation test and solder ball oxidation test in the first part as well as bonding pad design, assembly technology and material test in the second part. The test adopts nitrogen and the air to compare the probability of defects in the two atmospheric conditions and concludes that: The surface oxidation of the solder ball of the components affects the soldering quality. When the oxidation layer thickness reaches 250nm, the solderability is poor, resulting in soldering joint defects. The bonding pad design of the printed board will also affect the soldering quality. Good bonding pad design will lead to high first pass yield and poor design results in soldering joint defects such as HIP. The hot melting of soldering under air conditions is 3 times that of the basic hot melting Q and can fully guarantee the soldering joint quality. The soldering hot melting of the nitrogen reduced to 0.5Q can also guarantee good soldering first pass yield.