Title :
The effect of low-melting point alloy re-melting process on the quality of mixed BGA joint and its reliability
Author :
Hongqin Wang ; Zhonghua Wan ; Daojun Luo ; Zilian Liu
Author_Institution :
Fifth Res. Inst., MIIT, Guangzhou, China
Abstract :
In this paper, a serious crack phenomenon of Backward Compatible Assembled BGA joint with reflow and waving process was found and solved by the optimization of soldering process. The quality of BGA solder joints was confirmed after optimization. The mechanism of such cracking was illustrated.
Keywords :
ball grid arrays; cracks; reflow soldering; reliability; backward compatible assembled BGA joint; crack phenomenon; low-melting point alloy re-melting process; mixed BGA joint solder quality; mixed BGA joint solder reliability; reflow process; soldering process; waving process; Joints; Lead; Reflow soldering; Reliability; cracking mechanism; low melting point alloy; mixed BGA joint; reliability;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922693
