Anti-vibration structure analysis and optimizing on BGA packaging module

BGA Packaging electronics is inevitable to be shocked and vibration in transporting and using, which make a great impact on their reliability. In this paper, a modal analysis and a random vibration analysis on a module by packaging module model of SAC305 lead-free BGA solder joints with ANSYS Workbench finite element analysis software was presented. The natural frequency and vibration model in 0~2000Hz and the maximum 3 σ equivalent stress (44.627MPa) of BGA solder are obtained. Two improvement program of structure optimization, adding fastening-ring method and adding pillar method, which can be widely used in the engineering application are highlighted. Discussing and verifying that the maximum 3 σ equivalent stress can be down to 8.7553MPa by adding fastening-ring method, and the reliability of the module resisting vibration is improved.