Analysis of the influence of SOP lead shape on solder joint reliability

Author

Ren Chao ; Zeng Chenhui ; Shao Jiang ; Xue Heping ; Xu Wenzheng

Author_Institution

China Aero Poly-Technol. Establ. (CAPE), Beijing, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

538

Lastpage

541

Abstract

3-D finite element models of SOP (Small Outline Package) were constructed, in which Anand visco-plasticity constitutive equation was used to describe the mechanic behavior of solder joint. The solder joint deformation and stress distribution with five kinds of lead shapes were researched. The experimental program for the identification of numerical simulation was performed with three kinds of lead shapes. Both experimental and simulation results showed that the solder joint life is closely related with lead shape. The lead shape with low stiffness can decrease the stress apparently. With decreasing the bending radius or increasing the standoff height, the component reliability will be enhanced. The numerical simulation result was congruous with experimental testing data, can able to reflect the factual behavior of SOP accurately.

Keywords

elasticity; electronics packaging; finite element analysis; viscoplasticity; 3D finite element model; Anand visco-plasticity constitutive equation; SOP factual behavior; SOP lead shape; bending radius; component reliability; numerical simulation; small-outline package; solder joint deformation; solder joint life; solder joint mechanic behavior; solder joint reliability; standoff height; stiffness; stress distribution; Electronic packaging thermal management; Fatigue; Reliability; Shape; Soldering; Strain; Stress; SOP; finite element method; lead shape; reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922713

Filename

6922713