Title :
Electrical performance analysis and structure optimization for QFP-48 sockets
Author :
Sun Ling ; Wang Xuemin ; Sun Haiyan ; Wang Shenglong ; Yang Lingling
Author_Institution :
Jiangsu Key Lab. of ASIC Design, Nantong Univ., Nantong, China
Abstract :
In this paper, a 3D model of an existing IC socket used for a QFP packaged chip with 48 pins on a 0.5mm pitch is built in Ansys´s three-dimensional electromagnetic simulation software HFSS. Three different types of pin are simulated and their signal transmission characteristics are analyzed by comparing the simulated S-parameters. On the basis of this socket, a new socket physical model for QFP-48 is proposed with the change of pin´s structure. The simulated S-parameters of the same pins show that the modified socket model has better signal transmission performance and can achieve higher operating frequency. Furthermore, the relationship between this new socket´s relative permittivity and its signal transmission characteristics is analyzed.
Keywords :
S-parameters; integrated circuit modelling; integrated circuit packaging; permittivity; 3D model; Ansys 3D electromagnetic simulation software; HFSS software; IC socket; QFP packaged chip; QFP-48 sockets; S-parameters; electrical performance analysis; quad flat package; signal integrity; signal transmission; size 0.5 mm; socket physical model; structure optimization; Insertion loss; Integrated circuit modeling; Permittivity; Pins; Sockets; Solid modeling; Quad Flat Package; electromagnetic simulation; signal integrity; socket modeling;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922715
